Diaspark at TCEA 2012 convention & exhibition

FOR IMMEDIATE RELEASE
Edison, New Jersey, United States of America (Free-Press-Release.com) February 5, 2012 -- Diaspark Inc., a leading provider of outsourced product engineering services to education ISVs is attending the “32nd TCEA convention & exhibition”, Feb 6-10, 2012, at Austin, Texas.
With more than two decades of outsourced product engineering experience and variety of applications delivered in education vertical, Diaspark brings trio of technical, vertical and compliance expertise to assist Education ISVs. We assist them to deliver technically robust and industry compliant - FERPA, SCORM, IMS, AICC, W3C and IEEE software products.

Diaspark’s Enterprise Practice head- Parvindar S. Gujral says – “We are really excited to explore this event as it would help us to stay on top of the latest trends in the constantly changing instructional technology. Such events provide us multiple opportunities to explore ways technology can support the learning process, as well as examine the ways in which emerging technologies can be used instructionally.

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