Rogers Teams New RO4460 Prepreg with RO4360 Laminate for Matched 6.15-Dk Multilayer System Solution

FOR IMMEDIATE RELEASE
(Free-Press-Release.com) July 26, 2010 --
Chandler, Arizona - Rogers Corporation has developed the perfect prepreg match to its popular RO4360™ laminates: RO4460™ prepregs. Both materials feature consistent dielectric constant (Dk) of 6.15 ± 0.15 and low dielectric loss of 0.003 at 2.5 GHz. Together, they form an ideal system for fabricating compact, cost-sensitive multilayer amplifiers, antennas, and other high-frequency circuits where space is at a premium.

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Rogers Teams New RO4460 Prepreg with RO4360 Laminate for Matched 6.15-Dk Multilayer System Solution

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http://www.rogerscorp.com/acm

As with RO4360 laminates, RO4460 prepregs are ceramic-filled, thermoset materials reinforced by glass fibers for excellent mechanical stability. Compared to PTFE substrates, the high DK of Rogers RO4360 laminates and RO4460 prepregs allows designers to reduce the size of high-frequency circuits by typically 20% to 30%. The laminates and prepregs support smaller size circuits with excellent thermal conductivity of 0.8 W/m-K for effective thermal management.

RoHS-compliant RO4360 laminates and RO4460 bondply materials offer low coefficient of thermal expansion (CTE) of 30 ppm/°C in the z-axis for reliable plated through holes (PTHs) in multilayer circuits. In fact, the RO4360 laminates and RO4460 prepregs can be used with epoxy-based materials to form low-cost, hybrid multilayer circuits that take advantage of the smaller circuit features possible with 6.15 Dk materials.

With its high +280°C glass transition temperature (Tg), the RO4360/RO4460 laminate system processes like low-cost FR-4 circuit-board materials. RO4360 laminates and RO4460 prepregs bondply materials support automated manufacturing techniques and standard processing approaches for miniature, high-performance multilayer circuits without the high costs and processing complexity associated with PTFE circuit-board materials.

For more information on RO4360 laminates/RO4460 prepregs as well as Rogers RO4000® Series core materials, visit www.rogerscorp.com/acm.



About Rogers Corporation

Rogers Corporation (NYSE:ROG), headquartered in Rogers, CT, is a global technology leader in the development and manufacture of high performance, specialty-material-based products for a variety of applications in diverse markets including: portable communications, communications infrastructure, computer and office equipment, consumer products, ground transportation, aerospace and defense. Rogers operates manufacturing facilities in the United States (Arizona, Connecticut, and Illinois), Europe (Ghent, Belgium and Bremen, Germany) and Asia (Suzhou, China and Ansan, South Korea). In Asia the company maintains sales offices in Japan, China, Taiwan, South Korea and Singapore. Rogers has joint ventures in Japan and China with INOAC Corporation and in Taiwan with Chang Chun Plastics Co.

More information can be found online at http://www.rogerscorp.com/acm

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