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Quantum3D Announces Thermite TVC-3.0 Third Generation Tactical Visual Computer Family

November 27, 2007

Quantum3D Thermite TVC-3.0 COTS Mil-Spec PC Family Features an Enhanced Modular Architecture with State-of-the-Art Mobile CPUs, Advanced Mobile GPUs, FPGA Processing




FOR IMMEDIATE RELEASE
(Free-Press-Release.com) November 27, 2007 -- Quantum3D Thermite TVC-3.0 COTS Mil-Spec PC Family Features an Enhanced Modular Architecture with State-of-the-Art Mobile CPUs, Advanced Mobile GPUs, FPGA Processing, Quantum3D Eidetix Video Capture and Display, Removable Drive Bay Options, Flexible I/O and Networking Technology Packaged in a Conduction Cooled, Small Form Factor Enclosure Optimized for Deployed, Vehicle-Based and Man-Wearable, Visual Computing Intensive Applications Including Embedded Training, C4ISR, Mission Planning and Mission Rehearsal

ORLANDO, FL – I/ITSEC 2007 – November 26, 2007 – Quantum3D®, Inc., a leading provider of COTS, open architecture, realtime visual computing solutions, at the 2007 Inter-service/Industry Training, Simulation and Education Conference (I/ITSEC), announced that the Company’s third-generation Thermite® Tactical Visual Computer (TVC-3.0) Model 1000, in both deployable units and development kits, is now available for purchase.

Designed to compliment the Thermite TVC-2.0 family by providing a range of higher performance models that are optimized for deployed, extended-environment, vehicle-mount and man-wearable advanced visual computing applications that include embedded training and mission rehearsal, 3D enabled C4ISR, sensor processing and C2 that require desktop level visual computing performance in a small form-factor, conduction-cooled, mil-spec rugged system. Examples of such performance intensive applications include RealWorld™ from Total Immersion Software® and 3D-enabled C4ISR applications such as C3D™ from CG2®.

To support these performance intensive requirements, Thermite TVC-3.0 systems, including the Model 1000, are available with CPU/memory modules equipped with the latest Intel® mobile processors including Core™2 Duo processors with up to 4 gigabytes of high performance system memory, graphics modules with either NVIDIA® or AMD® advanced mobile 2D/3D GPUs with up to 256 megabytes of memory and FPGA-based processing subsystems including Quantum3D’s Eidetix™ advanced, COTS video capture and display subsystems.

The Thermite TVC-3.0 family features a highly modular architecture with support for both Microsoft® Windows®XP Embedded and Linux® operating systems that enables Quantum3D to tailor the system to meet a wide range of customer performance and functional requirements. The Thermite TVC-3.0’s modular design also enables the system to address obsolescence issues that plague competitive small form-factor systems by accommodating technology insertion of new CPU/memory, graphics, storage, FPGA processing, video capture and display, networking and I/O modules.



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  • Name: QUANTUM3D

    Email: ***@patterson.com





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